| 摘要 |
PROBLEM TO BE SOLVED: To prevent an electronic component from coming out of a storage container until a suction pad sucks it after a lid is removed from an upper face of a storage container at the time of mounting the electronic component on a substrate by specifying a height of a carrier from a flange base face to an upper face of the received electronic component to be a specific value or higher. SOLUTION: The electronic component carrier 1 comprises an electronic component 2 and a solder ball terminal 3 of the electronic component 2, wherein a pair where the electronic component 2 is received is a container. An upper face of the electronic component carrier 1 is a flange base face, while a height of the container is formed so that a height from the flange base face to an upper face of the electronic component 2 is 2 mm or more. If the height of the container is less, the electronic component is likely to come out due to vibration. Thus at the time of mounting the electronic component on a substrate, the component is prevented from coming out of the storage container due to vibration of a mounting machine until a suction pad of the mounting machine sucks the component after a lid is removed from an upper face of the storage container, thereby preventing failures in mounting from occurring.
|
