| 摘要 |
PROBLEM TO BE SOLVED: To completely remove a resist liq. deposited to the wafer back side by providing a spin chuck which holds the wafer back side and rotates it moving vertically, and a cleaning nozzle for blowing a cleaning liq. on the wafer back side. SOLUTION: A cleaning nozzle 11 is mounted on a housing. A spin chuck 2, while vacuum-chucking a wafer, is made adjustable from a slow rotation to a high speed rotation and lifted by a vertical moving mechanism 10 from the lowest position to an arbitrary height to change the clearance between the cleaning nozzle and wafer. When the wafer 1 is made to rotate, the spray position of a cleaning liq. on the wafer back side changes to clean the back side over a wide range. When in such a structure a wafer 1 of 8 inches aperture is chucked by the spin chuck 2, this results in about a circumferential width of 50 mm on the wafer back side being exposed from the spin chuck 2 which has a chucking face of 10 mmΦ diameter. |
