| 摘要 |
<p>A positive photosensitive resin composition. The composition comprising: (a) a capped polybenzoxazole precursor polymer having structure (I), wherein Ar1 is a tretavalent aromatic group, aliphatic group, heterocyclic group, or mixtures thereof; Ar2 is a divalent aromatic, heterocyclic, alicyclic, or aliphatic group that optionally may contain silicon; Ar3 is divalent aromatic group, aliphatic group, heterocyclic group, or mixtures thereof; Z is one of the groups (1, 2, 3, 4 and 5); x is 10 to 1000; y is 0 to 900; and b is 0.10 to 350; (b) a photosensitive agent; and (c) a solvent.</p> |
