| 发明名称 |
Semiconductor mounting package for heat dissipation |
| 摘要 |
<p>A semiconductor mounting package includes one or a plurality of diamond members (1) having one surface on which one or a plurality of semiconductor chips (20) are mounted and the other surface opposing to this one surface, and a high thermal conductivity metal member (2) adhered to the other surface of the diamond member. <IMAGE></p> |
| 申请公布号 |
EP0991121(A2) |
申请公布日期 |
2000.04.05 |
| 申请号 |
EP19990307599 |
申请日期 |
1999.10.01 |
| 申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
YAMAMOTO, YOSHIYUKI;IMAI, TAKAHIRO |
| 分类号 |
H01L23/14;H01L23/12;H01L23/36;H01L23/373;(IPC1-7):H01L23/373 |
主分类号 |
H01L23/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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