LEAD FRAME PLATING DEVICE

摘要

PROBLEM TO BE SOLVED: To shorten the ratio at which the forward and backward moving time of a sealing material occupies the entire part of the mechanical time of a lead frame plating cycle. SOLUTION: This plating device consists of a pump 7 which blows up a plating liquid 13, a transporting mechanism (not shown in Fig.) which successively carries the plural lead frames 20 into and out of the surface of the plating liquid to be blown up, the sealing member 6 which covers the surface of the lead frames 20 on the side opposite to the plating surfaces, an auxiliary cylinder 11 which holds the sealing member 6 and moves the same to as to move the sealing member to the position covering the lead frames 20 and a main cylinder 9 which holds the auxiliary cylinder 11 and moves the cylinder in the same direction.