| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a washing device and a washing method of a wafer which can execute a good washing treatment when compared to a conventional device and a method and can realize reduction in installation area by miniaturization of a device and reduction in running cost by cutting consumption of washing solution, etc. SOLUTION: A semiconductor wafer inside a wafer carrier 40 mounted on a loader 5 is subjected to pitch conversion to 1/2 pitch, for example, by a pitch conversion mechanism 42. Then, a semiconductor wafer which was subjected to pitch conversion is received by a rotary carrying arm 9 and is carried to a washing treatment bath 10, a washing treatment bath 11, a submerged loader 7, etc., one by one and a washing treatment is executed.</p> |
