发明名称 APPARATUS AND METHOD FOR EXFOLIATION OF INSULATING FILM IN LEAD PART OF MOLDED COIL
摘要 PROBLEM TO BE SOLVED: To provide an exfoliating apparatus for an insulating film, in which an exfoliating liquid or a cleaning liquid is not sprayed to parts other than a part to be exfoliated in a lead part, in which the exfoliating liquid or the cleaning liquid does not remain in the lead part, in which the insulating function of the film is not lowered, in which a soldering or welding bonding operation is stabilized, and in which the exfoliating operation of the film can be performed quickly. SOLUTION: In an exfoliating apparatus 9 for an insulating film in the lead part 3a of a molded coil 1 in which a conductor with the insulating film is wound and molded, a liquid tank which is installed in the bottom part of a body frame 21 and which is formed in such a way that an exfoliating liquid 5 and a cleaning liquid 7 are put respectively in separate tanks 6, 8 is constituted, In addition, an evacuating device 26, which is installed in the liquid tank to evacuate, a generated gas and a generated odor, is constituted. In addition, a drying device 11, which is placed on the upper part of the liquid tank to dry the cleaning liquid 7 stuck to the lead part 3a of the molded coil 1, is constituted. In addition, a coil loading device 12, which is arranged and installed at the upper part of the drying device 11 to be loaded with the molded coil 1, constituted. In addition, a moving device 10 which moves the coil loading device 12 on the body frame 21 up and down as well as right and left is constituted. In addition, heating devices 35a to 35e which maintain the exfoliating liquid 5 at a prescribed temperature are constituted.
申请公布号 JP2000092796(A) 申请公布日期 2000.03.31
申请号 JP19980259547 申请日期 1998.09.14
申请人 TOSHIBA CORP 发明人 KATSUKI MANABU;INOUE SABURO;ITO SHIGEYUKI
分类号 H02K15/04;(IPC1-7):H02K15/04 主分类号 H02K15/04
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