| 摘要 |
PROBLEM TO BE SOLVED: To relax stresses caused by the difference in terminal expansion between a semiconductor device to which the WPP technology is applied, and a mounting substrate. SOLUTION: A semiconductor device contains a passivation film 9 and a first protective film 10 both of which cover a third-layer wiring M3, a rearranged wiring 12 which is formed on the first protective film 10 and connected to the third-layer wiring M3 via a first connecting hole 11, a second protective film 13 covering the rearranged wiring 12, a bump base metals 2 formed in the second connecting holes 14 of the second protective film 13, and outer leads formed on the bump base metals 2. The outer leads are constituted of first bumps 3 on the bump base metals 2 and second bumps 4 on the first bumps 3. |
