| 摘要 |
PROBLEM TO BE SOLVED: To accurately measure a temperature of a substrate heated in a heating part by a dummy substrate having a thermal sensor. SOLUTION: A measuring pin 50 is provided in a lid 48 of a chilling hot plate 41 having a heating part 43. This pin 50 does not come into contact with a wafer W when heating the wafer W as a process substrate. When heating a dummy substrate having a thermocouple, the pin 50 comes into contact with an output terminal provided in the dummy substrate. After being processed by a process part 51, measuring results are displayed in a display part 52.
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