Substrate on which bumps are formed and method of forming the same

摘要

A bi-layer bump comprises a base layer composed of sprayed aluminum thick film having a thickness of about 20 mu m formed to cover the periphery of the passivation film formed on each pad electrode, a surface layer composed of sprayed copper thick film having a thickness of about 30 mu m formed on the base layer. According to the above-mentioned structure, a substrate on which bumps are formed which has an excellent electric property and connecting reliability, wherein an interlayer insulating layer, an active layer and a multi-layer wiring can be provided under the pad electrode can be obtained.