发明名称 CURABLE COMPOSITIONS
摘要 <p>A thermosetting composition which gives a cured phenolic resin having flexibility. The composition comprises (A) a vinyl polymer whose main chain has at least one terminal phenolic group and (B) a phenolic resin. Also provided are: a polymer produced by reacting (A) the vinyl polymer with (C) an aldehyde compound; and a thermosetting composition containing the polymer.</p>
申请公布号 WO2000015683(P1) 申请公布日期 2000.03.23
申请号 JP1999005004 申请日期 1999.09.14
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