| 摘要 |
PROBLEM TO BE SOLVED: To suppress the mixing of a liquid film with impurities in selectively forming the liquid film on a substrate and to uniformize the thickness distribution of the formed liquid film. SOLUTION: A liquid supply unit 10 having a liquid supply nozzle 11 is arranged above a substrate 15 to be treated. A film forming area and a film non-forming area are set to the substrate 15 to be treated and a constant amt. of a liquid 13 is continuously ejected to the substrate 15 from the nozzle 11. The substrate 15 and the nozzle 11 are relatively moved by a unit moving part 16 and liquid absorbing suction parts 12a, 12b are arranged under the nozzle 11. When the nozzle 11 is moved by the unit moving part 16 to become such a state that the liquid 13 ejected from the nozzle 11 is supplied to the film non-forming area, the liquid 13 is absorbed by the liquid absorbing section parts 12a, 12b and the supply of the liquid to the substrate 15 is cut off. |
