| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing method for a semiconductor device, in which the flow of a sealing resin in an underfill molding operation is improved, in which a clean sealing resin with little mixture of moisture and air bubbles is fed, and in which the density of the resin due to hardening shrinkage and the distribution of a filler become uniform. SOLUTION: In a resin sealing method for a semiconductor device 1, a semiconductor chip 4 is bonded to a wiring board 2 via solder balls 3, and the gap between the semiconductor chip 4 and the wiring board 2 is underfill-molded. In the resin sealing method, a resin feed process in which a sealing resin 5 used to seal the gap between the wiring board 2 and the semiconductor chip 4 is made to flow down, in a set amount, from a potting nozzle 6 so as to be fed is provided. In addition, a first heating process, in which the sealing resin 5 is heated to a prescribed temperature before the sealing resin 5 which flows down from the potting nozzle 6 reaches the gap, is provided. In addition a second heating process, in which the semiconductor device 1 whose gap is filled with the sealing resin 5 is heated from the central part of the semiconductor chip 4 and in which the sealing resin 5 is hardened sequentially toward its peripheral part, is provided.
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