| 摘要 |
<p>The invention concerns a method for counting chips on a batch of semiconductor wafers, in particular for counting good chips, comprising the following steps: a) transferring a specific wafer (30) from a storage cassette (22) to a zone for analysis under a count camera (26) lens; b) storing the wafer (30) image as delivered by the count camera (26); c) analysing the stored image to count the number of good chips while the wafer (30) is being transferred from the analysis zone towards the storage cassette (22) and/or while the next wafer in the batch is being transferred from the storage cassette (22) towards the analysis zone. The invention enables fast automatic counting of good chips on a batch of wafers.</p> |
