| 摘要 |
PURPOSE: A core welding device of a ceramic IC package using a laser is provided to prevent the reduction of a minute crack of a lower ceramic material and the settlement defect of a circuit, and to maintain the characteristic of the package before and after welding by using the laser as a heat resource. CONSTITUTION: The core welding device of a ceramic IC package reduces the maintaining costs of equipments such as the repair and the shift of an electrode necessarily accompanied after the welding of certain times in a resistance welding by comprising:a laser(20) as a heat resource of the welding; a transferring unit(41) to perform a welding by transferring a ceramic package(11) horizontally by installing on a table(40); a beam transferring subsection(30) to lead a laser beam radiated from the laser(20) to the transferring unit(41); a metal lead supply unit(50) to supply a metal lead(13) to the table(40) for welding; a ceramic package supply unit(60) to supply the ceramic package(11) to the table(40); an extracting unit(70) to extract the ceramic IC package finished the welding. |
