| 发明名称 |
HEAT RESISTANT RESIN COMPOSITION AND ADHESIVE SHEET USING THE SAME |
| 摘要 |
<p>A heat resistant resin composition comprising (a) a polyamide-imide resin and (b) a thermosetting resin component, said composition giving a cured product having a storage elastic modulus at 300 DEG C of 30 MPa or more, provides an adhesive sheet showing excellent solder heat resistance.</p> |
| 申请公布号 |
KR100249253(B1) |
申请公布日期 |
2000.03.15 |
| 申请号 |
KR19970049648 |
申请日期 |
1997.09.29 |
| 申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
SHINADA, EIICHI;TSURU, YOSHIYUKI;HORIUCHI, TAKESHI |
| 分类号 |
C08L63/00;C08L79/08;H05K1/00;H05K1/03;H05K3/38;H05K3/46;(IPC1-7):C08L79/08;C08J5/18 |
主分类号 |
C08L63/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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