WAFER AND CIRCUIT TAPE STICKING METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE

摘要

PURPOSE: Method for sticking wafer and circuit tape is provided to prevent a good and expensive wafer from becoming inferior and to improve the reliance by removing an inferior unit formed at the circuit tape where a circuit pattern is formed. CONSTITUTION: Method for sticking wafer and circuit tape comprising the steps of: providing a wafer where a number of semiconductor chips are formed; providing a circuit tape formed in the same size with the wafer, where units corresponding to the semiconductor chips formed on the wafer are formed, wherein the circuits are formed in the each unit; inspecting the each unit of the circuit tape into the good unit and the bad unit; cutting and removing the bad units of the circuit tape; cutting the good units corresponding to the removed part of the circuit tape at another circuit tape; sticking the circuit tape where the bad units are removed to the wafer; and sticking the good units cut at another circuit tape to the vacant space, corresponded to the bad unit, of the circuit tape stuck to the wafer.