| 摘要 |
PURPOSE: A BGA(ball grid array) package having fine pitch is provided to prevent a short between conductive patterns and reduce a resistance of the conductive pattern by forming land patterns on both surfaces of a mount tape. CONSTITUTION: The fine pitch BGA package (100) comprises a semiconductor chip (10) having a plurality of bonding pads (2), an elastomer (20) formed on the semiconductor chip (10), and a mount tape (30) formed on the elastomer (20). The mount tape (30) further includes an insulating tape (32) of plate structure; a first land pattern (42) for bonding to the bonding pads (2) and formed at one side of the insulating tape (32); a second land pattern (52) for bonding to the bonding pads and formed at other side of the insulating tape (32) being not overlapped with the first land pattern (42); and an open window (34). An outer land pattern (40) and an inner land pattern (50) are formed on the front surface and the rear surface of the mount tape (30), respectively.
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