首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
METHOD FOR BONDPAD PATTERN RECOGNITION IN WIRE BONDING SYSTEM
摘要
申请公布号
KR100250139(B1)
申请公布日期
2000.03.15
申请号
KR19970014776
申请日期
1997.04.21
申请人
SAMSUNG TECHWIN CO.,LTD.
发明人
KIM, TAE-WON
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
您可能感兴趣的专利
DEVICE FOR IMPROVED RESPONSE WHEN MEASURING VIBRATION FREQUENCY OF A VIBRATING OBJECT
Library terminal with indications for user
A self-service library terminal with article position indication
MANIKIN WITH COOLING PLATE
ANTHELMINTIC COMPOSITIONS
LOW PASS FILTER FOR ELECTROMAGNETIC SIGNALS
ANTIVIRAL SUBSTANCE, ANTIVIRAL FIBER, AND ANTIVIRAL FIBER STRUCTURE
Navigation apparatus and method of providing information on points of interest
Method for communicating with a lift assembly
Improved flowsensor
Rifle sling
VALVE AND HYDRAULIC CONTROL ARRANGEMENT
Multiple component packaging
Method and device for transferring groups or layers of articles to a loading station
Motor vehicle door handle with sensor electronics
Device and method for calculating the destination point of an observation unit, in particular of a firearm simulator
Method for monitoring the status of bearings of permanently excited synchronous machines and accompanying status monitoring device
Bonnet hinge for an articulated connection of a bonnet to a vehicle
Blocking module for a quick coupler in a construction machine
Computing system for the provision of a sports programme to remote users
