SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To enable semiconductor devices to be improved in yield in a semiconductor device assembly process by a method, wherein a semiconductor chip that is provided with electrodes on its main surfaces is fixed and bonded to support leads through the intermediary of an adhesive tape. SOLUTION: Electrodes 11 are formed on the circuit forming surface 10X of a semiconductor chip 10 along its sides, inner leads 2A of leads 2 are electrically connected to the electrodes 11 through the intermediary of conductive wires 12, and the outer leads 2B of the leads 2 are each formed like a gull wing. Furthermore the semiconductor chip 10 is fixed and bonded to the leads 3B of support leads through the intermediary of an adhesive tape 8. That is, the adhesive tape 8 is continuously parted on the lead 3B of the support lead 3 in the longer direction of the support lead 3 as it is partially led outside of the semiconductor chip 10.