Chip scale package

摘要

A patterned tape attached to a semiconductor chip in a chip scale package enhances process reliability in manufacturing of the chip scale package. A shape of the beam leads concentrates stresses in the part of the beam lead where the beam lead should be disconnected during the bonding of the beam leads to the chip bonding pads, and therefore, the part to be expected to be disconnected disconnects without damaging other parts of the beam lead. In addition, the reliability of a chip scale package is enhanced, because the beam lead attached to the chip bonding pad has little chance of being damaged during bonding.