| 摘要 |
A laminate construction for use in microwave electronics, such as for circuit boards or antennas, has expensive dielectric material having a low dissipation factor (Df < 0.005 at 1 GHz), such as PTFE/glass or Gore-ply3, only in the upper 200 mu m and less expensive dielectric material having a higher dissipation factor (Df > 0.005 at 1 GHz), such as FR-4, cyanate ester, BT/epoxy, polyimide thermount or polyimide, in the underlying 400 mu m of the dielectric material, thereby reducing cost while maintaining the same performance as regards low energy loss and consistency of the dielectric constant over the temperature and frequency range of use. |
