| 摘要 |
PROBLEM TO BE SOLVED: To reduce in size a module or a set associated with a light emitting element and a light receiving element by thinning the profiles of both elements as thin as possible. SOLUTION: As a light emitting element and a light receiving element, semiconductor chips 23, 24 are used, and a resin sealer for sealing them is formed of a material transparent for light. Slots 27 are formed on a region for emitting light from the element and a region for receiving the light to the element, and reflecting surfaces 26 are formed therein. As a result, the light can be emitted from and incident to the slots 27 via a side face E. Further, this reflecting surfaces are mirror formed to suppress attenuation in the path in the resin. |
