首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
摘要
申请公布号
JP2603375(Y2)
申请公布日期
2000.03.06
申请号
JP19930049939U
申请日期
1993.08.20
申请人
发明人
分类号
H01R13/04;H01R13/11;H01R24/00;(IPC1-7):H01R24/06;H01R12/16
主分类号
H01R13/04
代理机构
代理人
主权项
地址
您可能感兴趣的专利
MANUFACTURE OF STACKED DRAM
SEMICONDUCTOR DEVICE
YIELD DISTURBING STEP EXTRACTING SYSTEM AND METHOD
EXTERNAL APPEARANCE INSPECTING DEVICE FOR ELECTRONIC COMPONENT
BURN-IN BOARD MANAGEMENT METHOD AND BURN-IN BOARD, CHARGE/DISCHARGE UNIT AND BURN-IN BOARD MANAGEMENT SYSTEM
FORMING METHOD OF SEMICONDUCTOR DEVICE
INSPECTING APPARATUS
MANUFACTURE OF SEMICONDUCTOR DEVICE
MANUFACTURE OF SEMICONDUCTOR DEVICE
MANUFACTURE OF POLYMRIC WIRING
INHIBITION OF OXIDATION
SPINNER AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING SAME
MANUFACTURE OF SEMICONDUCTOR DEVICE
JIG FOR LIQUID PHASE EPITAXIAL CRYSTAL GROWTH AND METHOD OF MANUFACTURING MULTIELEMENT SEMICONDUCTOR CRYSTAL USING SAID JIG
CVD DEVICE
SURFACE PROCESSOR
MANUFACTURE OF FILM TRANSISTOR
CHARGED PARTICLE BEAM EXPOSING METHOD
LAMINATED CERAMIC CAPACITOR
INJECTION MOLDING METHOD FOR BONDED MAGNET AND MOLD THEREOF