| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to embody the narrowing of a display electrode pitch accompanying miniaturization and high fineness enhancement by providing the device with a heat sealing connector for electrically connecting a liquid crystal display panel and an IC packaging film substrate and constituting the device to an electrode shape arranged with the front ends of the extraction wiring of the liquid crystal display panel to a polygonal shape. SOLUTION: The connection of the film liquid crystal panel and the IC packaging film substrate 4 is attained via the heat sealing connector 3 from the problem of the heat resistance of a transparent film substrate. The IC packaging film substrate 4 is packaged with a driving IC 5 on the film substrate consisting of polyimide by using an anisotropically conductive film. The electrical connection is maintained from the driving IC through the conductive particles of the anisotropically conductive film. The copper foil wiring on the film substrate conducts by coming into contact with the conductive patterns 2 of the heat sealing connector 3. The extraction wiring 6 on the lower transparent film substrate is arranged to bend in mid-way shown in an enlarged part 7. The front ends of the bent extraction wiring 6 are arranged to the polygonal shape.
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