发明名称 BAKING AND HOT PLATE OVEN
摘要 PROBLEM TO BE SOLVED: To reduce the generation of static electricity and uniform the temperature of a substrate to be treated by placing the substrate to be treated on a heating plate of a hot plate oven through supporters, and heating part of the wall of the hot plate oven so that the temperature of the substrate to be treated may be uniform. SOLUTION: With a thermal bulkhead side plate 3a moved in a direction A toward a hot plate 2, a TFT array substrate 1 is inserted from between the side plate 3a and a thermal bulkhead top plate (top plate) 3b to be mounted on supporters 8 on the hot plate 2. Next, the side plate 3a is moved in a direction B toward the top plate 3b to heat-treat the TFT array substrate 1 in an airtight or semi-closed oven. In this heat treatment, the hot plate 2 is heated up to 90 deg.C and the side plate 3a and the top plate 3b are also heated by a heater 10a up to 90 deg.C. After heat treatment, the side plate 3a is moved in the direction A to take out the TFT array substrate 1.
申请公布号 JP2000068178(A) 申请公布日期 2000.03.03
申请号 JP19980231059 申请日期 1998.08.18
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YOKOZEKI MAKOTO;OTSUKA REI
分类号 H01L21/027;H01L21/336;H01L29/786;(IPC1-7):H01L21/027 主分类号 H01L21/027
代理机构 代理人
主权项
地址