| 摘要 |
PROBLEM TO BE SOLVED: To enable solder balls to be mounted reliably on a substrate, even if the diameter dimension of apertures formed in the substrate becomes smaller in a semiconductor device, and a manufacture thereof and of a circuit board where solder balls are disposed on apertures with a small diameter formed in the substrate. SOLUTION: When solder balls 10 are mounted on a substrate 2, in which aperture parts 14 at one end of which an electrode film 5 is formed are formed, a solder paste 13 is first printed on the aperture parts 14, and this solder paste 13 is heated and melted. Consequently, a solder 15 in the solder paste 13 flows into the aperture parts 14 and fills these aperture parts 14 to connect with the electrode film 5. Subsequently, solder balls 10 are bonded with the solder 15 filled in the aperture parts 14. In this manufacture, since the solder paste 13 is heated and melted prior to bonding the solder balls 10, the aperture parts 14 can be positively filled with solder 15, even if a diameter dimension L2 of the aperture parts 14 is small. Therefore, sure electrical connection of the electrode film 5 and the solder ball 10 is made. |
