| 摘要 |
The invention relates to thermoplastic molding materials containing: A) 5 to 96.99 wt. % of a polyester; B) 1 to 30 wt. % of a nitrogen compound; C) 0.1 to 30 wt. % of a phosphorous compound of general formula (I) in which the substituents have the following meaning: R<1> to R<20>, independent of one another, represent hydrogen, or a linear or branched alkyl group of up to 6 C-atoms; n represents a mean value ranging from 0.5 to 50; and X represents a single bond C=O, S, SO2, C(CH3)2; D) 0.01 to 5 wt. % of at least one ester or amide of saturated or unsaturated, aliphatic carboxylic acids with 10 to 40 C-atoms with aliphatic, saturated alcohols or amines with 2 to 40 C-atoms; E) 1 to 50 wt. % of a fibrous or particle-shaped filler or mixtures thereof; F) 0 to 60 wt. % of additional additives, whereby the sum of the weight percentages of components A) to F) total 100 % each time. |
