| 摘要 |
<p>A laminate construction for use in microwave electronics, such as for circuit boards or antennas, has expensive dielectric material having a low dissipation factor (Df < 0.005 at 1 GHz), such as PTFE/glass or Gore-ply®, only in the upper 200 νm and less expensive dielectric material having a higher dissipation factor (Df > 0.005 at 1 GHz), such as FR-4, cyanate ester, BT/epoxy, polyimide thermount or polyimide, in the underlying 400 νm of the dielectric material, thereby reducing cost while maintaining the same performance as regards low energy loss and consistency of the dielectric constant over the temperature and frequency range of use.</p> |
