| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer with a protective sheet attached thereto capable of restraining occurrence of warpage in a back grinding process. SOLUTION: This semiconductor wafer 1 with a protective sheet attached thereto is a semiconductor wafer with a protective sheet 2 attached to its surface, and the protective sheet 2 is attached in a state where the maximum direction of warpage on a wafer surface and the maximum direction of a shrinkage percentage or shrinkage force on the protective sheet 2 are slipped. Additionally, the semiconductor wafer 1 the protective sheet attached thereto can do when the protective sheet 2 is attached so that the minimum direction of warpage on a wafer surface (for example, cleavage direction) and the maximum direction of the shrinkage percentage or the shrinkage force on the protective sheet 2 (for example, attaching direction, MD direction or extending direction at the time of sheet manufacturing) come to be in parallel with each other.
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