| 摘要 |
An object is to compatibly improve processing speed and storage capacity of semiconductor memory that the operation portion can use. Each of units (10a, 10b) each having an operation portion (11) and a memory portion (12) is formed of a single semiconductor chip. A data signal is separately stored in the two memory portions (12) in a bit-sliced form and each of the two operation portions (11) can use the 32-bit-wide data signal stored in the entirety of the two memory portions (12) through interconnections (22, 23). That is to say, each operation portion (11) can use a storage capacity twice larger than the capacity that can be ensured in a single semiconductor chip. Provided as interconnections for coupling the semiconductor chips are only the interconnections (22, 23) for transferring data signals from the two memory portions to the two operation portions (11). Hence, the bit width of the interconnections (22, 23) can be increased to increase the transmission speed of the data signals and to increase the processing speed of the device.
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