ALUMINA SPUTTERING TARGET, ITS PRODUCTION AND HIGH- FREQUENCY SPUTTERING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an alumina sputtering target of high purity for accelerating the film forming rate of an alumina film on a substrate by sputter discharge and moreover hard to be cracked even in the case high electric power is applied. SOLUTION: An alumina sputtering target 5 is composed of an alumina sintered body having 5 to 20μm average crystal particle size and 0.3 to 1.5 porosity. As to this target, a compacted body is produced without adding magnesium to alumina raw material powder, and this compacted body is sintered at 1650 to 1750 deg.C.