| 摘要 |
PROBLEM TO BE SOLVED: To obtain an insulating die attach paste excellent in quick curability, heat resistance, and moisture resistance of adhesion by compounding a specific urethane di(meth)acrylate, a di(meth)acrylate, a phosphoric acid group-contg. (meth)acrylate, an alicyclic epoxidized alkoxysilane, an org. peroxide and/or an azo compd., and a bismaleimide deriv. SOLUTION: This paste comprises (A) a urethane di(meth)acrylate obtd. by reacting a hydroxyalkyl(meth)acrylic acid, a polyalkylene glycol, and a diisocyanate, (B) a di(meth)acrylate of formula I, (C) a phosphorie-acid-group- contg. (meth)acrylate of formula II or III, (D) an alicyclic epoxidized alkoxysilane, (E) an org. peroxide and/or an azo compd., and (F) a bismaleimide deriv. in such wt. ratios that: 0.1<=A/B<=5, 0.001<=(C+D)/(A+B)<=0.05, 0.1<=C/D<=10, 0.01<=E/(A+B)<=0.05 and 0.05<=F/(A+B+C+D)<=0.70. |
