发明名称 SIMULTANEOUS PROCESSING METHOD OF PLURALITY OF WAFER
摘要 <p>PROBLEM TO BE SOLVED: To economize an operating time, and to improve profitability of wafer machining by effectively preventing the waiting time of different wafer boxes by simultaneously machining wafers in the different wafer boxes respectively in different processing chambers. SOLUTION: A first wafer box 1, a second wafer box 2 and a third wafer box 3 are placed in standby in a first shelf 10, a second shelf 20 and a third shelf 30 respectively. When the wafers in each one wafer box are forwarded to different processing chambers 11,12,13,14 and processed, the order of the transfer processing of the wafers is set in first wafer-box processing order 31, second wafer-box processing order 32 and third wafer-box processing order 33, and all different wafer boxes are sent into the different processing chambers for the same period and can be processed. Accordingly, the processing waiting time of the different wafer boxes can be prevented, and the time required for a wafer manufacturing process can be economized effectively.</p>
申请公布号 JP2000058615(A) 申请公布日期 2000.02.25
申请号 JP19980229454 申请日期 1998.07.31
申请人 PROMOS TECHNOL INC;TAIWAN MAOXI ELECTRONICS CO LTD;SIEMENS AG 发明人 KO TOKUEI;HAN KOHAKU;RI JIKETSU
分类号 H01L21/677;G05B19/418;H01L21/00 主分类号 H01L21/677
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