发明名称 ELECTRONIC COMPONENT AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an electronic component which can suppress the generation of tombstone phenomenon, make it difficult for a plating solution or the like to infiltrate thereinto, reduce the amount of solder used on mounting thereof with the use of solder or the like, and be made high in its mounting reliability. SOLUTION: In this method for manufacturing an electronic component, conductive paste is applied so as to cover first and second end faces 2a and 2b of a ceramic sintered member 2 as an electronic component element body and so as to arrive at upper and lower faces 2c and 2d thereof and at parts of a pair of side faces thereof, dried to form a dried conductive paste layer after the completion of drying, parts of the conductive paste layer above the first and second end faces 2a and 2b are deformed and worked so as to be flattened, and then the conductive paste layer is backed to form first and second terminal electrodes 7 and 8. A laminated capacitor 1 is obtained as an electronic component by this electronic component manufacturing method.
申请公布号 JP2000058374(A) 申请公布日期 2000.02.25
申请号 JP19980229004 申请日期 1998.08.13
申请人 MURATA MFG CO LTD 发明人 KUROIWA SHINICHIRO;TAKAHASHI MASARU;TAKAGI GIICHI
分类号 H01G4/252;H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/252
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