| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for simply manufacturing a semiconductor device such as a chip size package comprising a sealing material layer formed to cover a surface of an element forming bumps and to expose an edge of the bump. SOLUTION: A wafer having an reactive sealing material on it is put on a supporting body for molding, the reactive sealing material is covered by a film for stripping, and the sealing material is spread over the surface of the wafer by heating and pressurizing through the wafer and the film for stripping. The sealing material is molded for the time required more than 30% to less than 100% of a reactive rate of the sealing material under this molding temperature, the sealing material is cooled, the sheet for stripping is stripped off, the wafer is sealed by the sealing material so that an end face of a bump is exposed, and the wafer is cut into individual elements. The sealing material desirably comprises a composition of an epoxy resin, hardener solvent, filler, and hardener catalyst.
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