An encapsulated material is described of which at least a part of the material is kept encapsulated during heat treatment in an aqueous environment and is released during cooling after a heat treatment. The material is encapsulated in a layer of a hydrophobic film-forming material and a layer of a material having a low critical solution temperature (LCST) below the treatment temperature. The layer containing the hydrophobic material may be situated inside the layer having the LCST and have a melting point below the LCST, but it may also be situated outside the layer having the LCST and have a melting point above the LCST of said layer. Said layers may also be applied together.
申请公布号
EP0980215(A1)
申请公布日期
2000.02.23
申请号
EP19980920737
申请日期
1998.05.01
申请人
INSTITUUT VOOR AGROTECHNOLOGISCH ONDERZOEK (ATO-DLO)