发明名称 FLEXIBLE PRINTED WIRING BOARD AND MANUFACTURE THEREFOR
摘要 PROBLEM TO BE SOLVED: To thin a gold plated layer and to improve the joining property of a bonding wire and the shear strength of a solder ball, by palladium or nickel palladium alloy plating between the nickel plating layer of a plating part and the gold plated layer on a surface. SOLUTION: In this flexible printed wiring board whose base material is an insulating resin film, a plated layer is turned to at least a three-layer structure and the palladium or nickel palladium alloy plated layer is provided between the nickel plated layer and the gold plated layer on the surface. The gold plated layer is provided by flash gold plating and non-cyanide flash gold plating.
申请公布号 JP2000049430(A) 申请公布日期 2000.02.18
申请号 JP19980212163 申请日期 1998.07.28
申请人 SUMITOMO METAL MINING CO LTD 发明人 TAKAHASHI HIDEKI
分类号 H05K1/09;H05K1/02;(IPC1-7):H05K1/09 主分类号 H05K1/09
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