发明名称 |
FLEXIBLE PRINTED WIRING BOARD AND MANUFACTURE THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To thin a gold plated layer and to improve the joining property of a bonding wire and the shear strength of a solder ball, by palladium or nickel palladium alloy plating between the nickel plating layer of a plating part and the gold plated layer on a surface. SOLUTION: In this flexible printed wiring board whose base material is an insulating resin film, a plated layer is turned to at least a three-layer structure and the palladium or nickel palladium alloy plated layer is provided between the nickel plated layer and the gold plated layer on the surface. The gold plated layer is provided by flash gold plating and non-cyanide flash gold plating.
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申请公布号 |
JP2000049430(A) |
申请公布日期 |
2000.02.18 |
申请号 |
JP19980212163 |
申请日期 |
1998.07.28 |
申请人 |
SUMITOMO METAL MINING CO LTD |
发明人 |
TAKAHASHI HIDEKI |
分类号 |
H05K1/09;H05K1/02;(IPC1-7):H05K1/09 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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