| 摘要 |
PROBLEM TO BE SOLVED: To improve efficiency of inspection by automatically obtaining information about a pattern arrangement in inspection of appearance. SOLUTION: A stage 2 supports a semiconductor wafer 30 on which a repeated pattern is formed. A CCD camera 4 picks up image of the semiconductor wafer 30. A control section 6 captures and stores the reference image data of the repeated pattern, which is positioned on a registered original position by processing the image, and the control section 61 shifts the stage 2 along the repeating direction of the repeated pattern. Furthermore, by the control section 6, an image processing is performed on the image data of the repeated pattern positioned on a shift point, the reference image data and the image data on the shift position are matched with each other, and difference image data is acquired, based on the two image data. Then the control section 6 repeatedly shifts and matches the stage 2 and repeatedly shifts the stage 2 and acquires difference image data to acquire information about the pattern arrangement of the repeated pattern. |
