| 摘要 |
PROBLEM TO BE SOLVED: To make many semiconductor packages to be laminated upon another efficiently by directly connecting the prescribed second leads of the second semiconductor package to the first leads of the first semiconductor package. SOLUTION: A laminated package is formed by respectively connecting the leads P1B-P18B and P20B-P27B of the second semiconductor package ICB excluding a CS(chip selection) lead 19B directly to the leads P1A-P18A and P20A-P27A of the first semiconductor package ICA. In forming the package, one 415B of the NC leads of the second package ICB is made to function as a CS by intentionally disconnecting the outside connection of the CS lead 419B of the second package ICB from the outside connection of the CS lead of the first package ICA by making the outside connection of the lead 419B shorter in length. |
