发明名称 RESIN COMPOSITION AND ADHESIVE USING SAME
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition for adhesives which does not adversely affect a human body and the environment and is safe as an adhesive for wood for use in construction materials, and furniture and the like and has the performance of a small reduction in adhesion against high temperature hot water. SOLUTION: This curable resin composition is obtained by adjusting the pH of a mixture comprising, as the protective colloid, a vinyl acetate based polymer emulsion using a modified polyvinyl alcohol whose hydroxyl groups have been partially acetoacetoxylated and an unsaturated (meth)acrylate having two or more (meth)acryloyl groups in the molecule or comprising, in addition to these two components, calcium carbonate to 8 or more. An adhesive for wood is composed of the curable resin composition.
申请公布号 JP2000038548(A) 申请公布日期 2000.02.08
申请号 JP19980232830 申请日期 1998.08.19
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 UCHIDA JIRO;NISHIIKE HARUKI;MIYASHITA YASUAKI;KOMATSU AKIHIKO;TAKIYAMA EIICHIRO
分类号 C08L29/04;C08F299/00;C08L63/10;C08L67/06;C08L75/14;C09J4/02;(IPC1-7):C09J4/02 主分类号 C08L29/04
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