发明名称 COMPOUND MATERIAL
摘要 PROBLEM TO BE SOLVED: To sufficiently lower the resistance value of a PTC thermistor in the ordinary time and also to thermally stabilize the same, by a method wherein at least a specific amount of at least one kind of a metal and/alloy having a means grain diameter decreasing the volume thereof by melting down is dispersed in an amorphous body mainly comprising C. SOLUTION: 10-90 wt.% of at least one kind of metal and/or alloy in the means grain diameter of 0.5-500 nm decreasing the volume thereof by melting down is dispersed in an amorphous body mainly comprising C. This amorphous body mainly comprising C is produced by heat-treating a heat resistant polymer in reducing atmosphere. As for the heat resistant polymer, a stiff chain heat resistant polymer such as polyimide, polyoxadiazole, polyparaphenylenevinylene, etc., are preferable. Besides, as for the metal and/or alloy decreasing the volume by melting down, those meeting the operational principles are preferable such as one of the metals out of Bi, Sb, Ga, Ge, Si or one of the alloys out of Bi-Pb- Sn, Bi-Pb-Sn-Sb, etc.
申请公布号 JP2000040601(A) 申请公布日期 2000.02.08
申请号 JP19980208761 申请日期 1998.07.24
申请人 UBE IND LTD 发明人 HARUTA SHINSUKE;ODA HIROSHI
分类号 C04B35/52;C01B31/02;H01C7/02 主分类号 C04B35/52
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