| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly refined and reliable printed wiring board and a palladium inactivating treatment liquid therefor, by inactivating a palladium remaining on the surface of an insulation layer as a catalyst so as to improve the insulation property of a circuit pattern, in a method for manufacturing a printed wiring board using an additive method to form the circuit pattern by a copper plated layer formed on the surface of the insulation layer. SOLUTION: After a circuit pattern is formed, a laminated body 10 in which a palladium appears is dipped in a palladium inactivating treatment liquid where 1 V% ammonium liquid as a dissolving agent is dissolved by 1 wt.% sulfide compound, so that palladium ions on the surface of an insulation layer are inactivated and their catalytic function is lost. Then it is picked up and washed with water to remove the adhering treatment liquid.
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