| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket pin which is mounted on a board without soldering and can absorb the stress caused by an external force at the time of inserting a lead. SOLUTION: A socket pin in cylindrical shape has a lead insert hole and is inserted in a hole provided on a board so that electrical connection is made between a lead component and the wiring on the board. A lead holding piece 15 has resilience whose one end is fixed to near the inside of the lead insert hole so that the leads of an inserted component are held. Angle-shaped projections 13 and 14 having resilience are provided along slits formed parallel with the cylindrical shaft of the socket pin and generate socket pin fixing to the board by applying a force to the board from the side face of the hole when the socket pin is inserted into the hole. Thus the socket pin can be mounted on the board without soldering. The resilience of projections 13 and 14 allows absorbing the stress caused by external force.
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