发明名称 |
Polishing pads for a semiconductor substrate |
摘要 |
A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capillary passage. The pores of the porous substrate have an average pore diameter of from about 5 to about 100 microns which enhances pad polishing performance. |
申请公布号 |
AU4982799(A) |
申请公布日期 |
2000.02.01 |
申请号 |
AU19990049827 |
申请日期 |
1999.07.08 |
申请人 |
CABOT CORPORATION |
发明人 |
SRIRAM P. ANJUR;ROLAND K. SEVILLA;FRANK B. KAUFMAN |
分类号 |
B24B37/22;B24B37/24;B24B41/047;B24D3/32;B24D13/14;C09K3/14;H01L21/304 |
主分类号 |
B24B37/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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