| 摘要 |
PROBLEM TO BE SOLVED: To precisely align a semiconductor chip with a contact sheet at any time. SOLUTION: When a semiconductor chip 1 is dropped in along a test socket guide block 7 the semiconductor chip 1 is roughly aligned with a contact sheet 3 under the guidance of the guide block 7 firstly. Then, hemispheric contact terminals 2 of the semiconductor chip 1 are guided by ring parts of ring-shaped contact terminals 9 of the contact sheet 3 so as to be fitted into the ring-shaped contact terminals 9 of the contact sheet 3. Thus the semiconductor chip 1 is roughly aligned with the contact sheet 3 under the guidance of the guide block 7, and then, the semiconductor chip 1 is newly aligned with the contact sheet 3 by the ring-shaped contact terminals 9 of the contact sheet 3. Accordingly, because the semiconductor chip 1 is precisely aligned with the contact sheet 3 at any time, no displacement between each the contact terminal 2 of the semiconductor chip 1 and each the contact terminal 9 of the contact sheet 3 occurs so that the two contact terminals 3, 9 are electrically connected without fault.
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