Electronic component with semiconductor component and lead frame

摘要

The component consists of a semiconductor element (1) encased in a housing (2). One end (3) of the housing has the outer ends (4) of the lead frame (5) projecting outwards, bent at 90 degrees for surface mounting on a PCB. The inner ends (6) of the lead frame are connected with the semiconductor element. The lead frame has integral parts (8) formed with increased width with respect to the outer ends, by folding by 180 degrees to provide a positioning element (14) in the functional area. The increase of width provides a secure mechanical positioning on a carrier.