发明名称 Method of fabricating buried source to shrink cell dimension and increase coupling ratio in split-gate flash
摘要 A method is provided for forming a split-gate flash memory cell having reduced size, partially buried source line, increased source coupling ratio, improved programmability, and overall enhanced performance. A split-gate cell is also provided with reduced size and improved performance. The source line is formed in a trench in the substrate over the source region. The trench walls provide increased source coupling and the absence of gate bird's beak with the trench together shrink the cell size. Programmability is also enhanced through more favorable hot electron injection though intergate oxide between the floating gate and the control gate.
申请公布号 US6017795(A) 申请公布日期 2000.01.25
申请号 US19980072996 申请日期 1998.05.06
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY 发明人 HSIEH, CHIA-TA;TSAO, JENN;KUO, DI-SON;LIN, YAI-FEN;SUNG, HUNG-CHENG
分类号 H01L21/8247;H01L27/115;(IPC1-7):H01L21/824 主分类号 H01L21/8247
代理机构 代理人
主权项
地址