| 摘要 |
A circuit element mounting structure includes (a) a substrate having a pattern A of wirings therein, (b) at least one cavity formed in a surface of said substrate, and (c) a cap for covering the cavity. The cap includes a pattern B of wirings therein, and a recess for electrically-connecting the pattern B of wirings to the pattern A of wirings. The substrate includes a raised portion for electrically-connecting a connection B to the pattern A of wirings. The recess and raised portion are configured to be engagable with each other. In accordance with the invention, it is possible to mount circuit elements on the cap, and also possible to mount circuit elements in higher density on a substrate that includes a cap zone. |
