| 摘要 |
PROBLEM TO BE SOLVED: To achieve a compact configuration for a semiconductor device. SOLUTION: This semiconductor device, in which a semiconductor chip on which a plurality of amplifying means are formed and the electrode of the semiconductor chip and the electrode of a wiring board are electrically connected by a wire. A substrate-side bonding electrode 2c, to which a wire 7c fixed to a reference electric potential is connected, is arranged at the position, which is separated remote from one side 5X of a semiconductor chip 5 from a substrate-side output electrode 2B, to which an output wire 7B is connected. A substrate-side input electrode 2A, to which an input wire 7A is connected, is arranged at a position, where the distance from one side 5X from the semiconductor chip 5 becomes approximately equal to the substrate-side output electrode 2B, or the a position, which is separated remote from one side 5X of the semiconductor chip 5 from the substrate-side bonding electrode 2C. |
